In 5G , apps , chip , handset , Mobile , Networking , News , Qualcomm , RF360 , Smartphone , Tablet , Technology NEWS , Top Stories , Top Story 3 , wireless
Qualcomm shells out $3.1B to take full control of RF360 mobile parts business
Qualcomm Inc. today said that it has reached a $3.1 billion deal with TDK Corp., a Japanese electronics maker,.